Memory corruption in QESL while processing payload from external ESL device to firmware.
References
Link | Resource |
---|---|
https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin | Vendor Advisory |
https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin | Vendor Advisory |
Configurations
Configuration 1 (hide)
AND |
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History
21 Nov 2024, 07:55
Type | Values Removed | Values Added |
---|---|---|
References | () https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin - Vendor Advisory |
12 Apr 2024, 17:17
Type | Values Removed | Values Added |
---|---|---|
CWE | CWE-120 | |
Summary |
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Information
Published : 2023-08-08 10:15
Updated : 2024-11-21 07:55
NVD link : CVE-2023-28561
Mitre link : CVE-2023-28561
CVE.ORG link : CVE-2023-28561
JSON object : View
Products Affected
qualcomm
- qcn7606_firmware
- qcn7606